Stora Enso and NXP Semiconductors are now developing intelligent packaging solutions. The focus is on integrating RFID (Radio frequency identification) into packages for consumer engagement and supply chain purposes.
By using NXP’s RFID technology such as near field communication (NFC) and ultra-high frequency (UHF), Stora Enso will in the future have smart packages that can be easily tracked and traced through the entire supply chain, providing full end-to-end transparency. The integrated technology will also be able to detect if the intelligent package has been tampered with en-route to the consumer and, once in the hands of the consumer, could provide additional information and interaction through an NFC-enabled smartphone.
“The co-operation with NXP offers substantial business opportunities for Stora Enso. We have already worked on several concept cases with customers and partners within intelligent packaging. The co-operation with NXP will enable us to bring this development closer to market and provide faster scalability in intelligent paper and board solutions,” says Karl-Henrik Sundström, CEO, Stora Enso.
Click here for source (Packaging Gateway)
Photo: NXP Semiconductors
